
OEM + Tier 1 + IC Company Integrated
Innovation Ecosystem Construction
Focusing on the policy requirements for the localization of auto IC, SAICEC leverages its platform advantages to create a domestically-developed, independent and controllable [car & chip integration] innovation ecosystem through the "platform + ecosystem" model.
Support OEMs in selecting domestic chip suppliers and design companies to achieve full autonomy and control of Chinese auto IC
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Automobiles and chips develop together to create the future
SAICEC will build the first 12-inch automotive-grade chip R&D pilot line in China, focusing resources on developing the "bottleneck" process of auto IC.
The planned capacity of the first phase is 5,000 pieces/month, and the planned capacity of the second phase is 10,000 pieces/month.
The process node will be increased from 180nm - 90nm to 55nm,
completing the full-process ecosystem construction of auto IC from design services to foundry.